The Dynamic Slide Transfer supports the sending and receiving cassettes on a bearing-supported moving platform which virtually eliminates particle generation. Models are available to transfer wafers between any cassette type including metal and half-height cassettes. A safety lock prevents movement before cassettes are securely located on the moving platform. Another advantage of this model is the extremely small footprint. Wafers are transferred by edge-only contact with clean, low particle material. A wide-pusher option is available for flatted wafers to maintain alignment if flats are generally in direction of pusher. Models are available for all wafer sizes except 300mm.

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GL Automation was established in 1989 with a mission to provide innovative, high-quality, and cost effective wafer handling and automation solutions to the worldwide Semiconductor and Solar industries.
Headquartered in Dallas, Texas, GLA supports product installations worldwide.
T: 214.503.9888
F: 214.503.6060
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Sales@glautomation.com
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