The Standard Slide Transfer is a cost-effective solution for reliable wafer transfer between all types of plastic and metal cassettes. This unit is especially suited for easy wafer transfer between full and half height cassettes. Low particle slide surfaces can be selected from Teflon, UHMW, and ultra-low friction, specially treated anodized aluminum. The UHMW surface is used for metal cassettes. Wafers are transferred by edge-only contact using clean, low particle materials. A wide-pusher option is available for flatted wafers to maintain alignment if flats are generally in direction of pusher. Models are available for all wafer sizes except 300mm.
GL Automation was established in 1989 with a mission to provide innovative, high-quality, and cost effective wafer handling and automation solutions to the worldwide Semiconductor and Solar industries.
Headquartered in Dallas, Texas, GLA supports product installations worldwide.
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