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  GLA offers a family of affordable, easy to use tools for BGA package prototyping, pilot production, and production of small lots. The hand operated, tabletop unit performs feeding, X-Y grid staging, and precision placement of solder balls onto BGA substrates.

  Configurations are available for placing balls on single substrates or a matrix of substrates. One of our largest capacity tools places solder balls onto a 3 x 6 matrix of substrates, each substrate having 300 solder ball sites. In a single stroke this tool places 5,400 solder balls.

  The small size, high accuracy, ease-of-use, production-proven performance and reliability make it an excellent choice.


  GL Automation was established in 1989 with a mission to provide innovative, high-quality, and cost effective wafer handling and automation solutions to the worldwide Semiconductor and Solar industries.

  Headquartered in Dallas, Texas, GLA supports product installations worldwide.


T: 214.503.9888

F: 214.503.6060


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