GLA offers a family of affordable, easy to use tools for BGA package prototyping, pilot production, and production of small lots. The hand operated, tabletop unit performs feeding, X-Y grid staging, and precision placement of solder balls onto BGA substrates.

　　Configurations are available for placing balls on single substrates or a matrix of substrates. One of our largest capacity tools places solder balls onto a 3 x 6 matrix of substrates, each substrate having 300 solder ball sites. In a single stroke this tool places 5,400 solder balls.

　　The small size, high accuracy, ease-of-use, production-proven performance and reliability make it an excellent choice.